Semiconductor Engineering

Choosing The Right Memory Solution For AI Accelerators

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...
Semiconductor Engineering

HBM4E Raises The Bar For AI Memory Bandwidth

The pace of AI innovation continues to expose a painful reality. Compute keeps scaling, but memory bandwidth remains one of the hardest bottlenecks to remove. As AI models grow larger and more complex ...
Electronic Design

HBM4 and SPHBM4: Scaling Memory Bandwidth for AI and HPC

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...

As HBM shortages bite, AMD turns to software to stretch AI memory

The acquisition could help enterprises use costly memory more efficiently across AMD’s data-centre stack, though analysts say ...
Business Wire

Enfabrica Unveils Industry’s First Ethernet-Based AI Memory Fabric System for Efficient Superscaling of LLM Inference

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Enfabrica Corporation, an industry leader in high-performance networking silicon for artificial intelligence (AI) and accelerated computing, today announced the ...
Business Wire

Kioxia Achieves Successful Prototyping of 5TB Large-Capacity and 64GB/s High-Bandwidth Flash Memory Module

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...