Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, ...

QR codes and NFC tags are making packaging smarter, giving people instant access to trusted product information.

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafers to 310mm x ...

While much has been said about advanced packaging in the context of Malaysia's semiconductor sector, little is actually known ...

It puts packaging on display with their products, in such a way that high-end brands have invested a lot in high-end ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Imagine a line of garbage trucks, filled to capacity with discarded plastic packaging, stretching bumper-to-bumper across three lanes of traffic all the way down I-95 from Boston to Miami. Then dump ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

The Packaging Science and the Graphic Media Science and Technology (GMST) departments at Rochester Institute of Technology will merge, as part of the continuing strategic growth of RIT’s College of ...

STEM-OPT Visa Eligible: The STEM Optional Practical Training (OPT) program allows full-time, on-campus international students on an F-1 student visa to stay and work in the U.S. for up to three years ...