SHENZHEN, GUANGDONG, CHINA, June 11, 2026 /EINPresswire.com/ — Reliability in printed circuit board assembly often hinges on the integrity of the solder joint ...
In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...
Ever since automated optical inspection (AOI) became a mainstay of a manufacturer's test strategy, planners have debated where to place it in the production process. Do you inspect the solder paste ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Japanese storefront Shigezone has recently listed a USB PD (Power Delivery)-operated reflow oven. The top plate reaches a maximum temperature of 280 degrees Celsius at default settings or 350 degrees ...
Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...
Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...
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