The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.
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AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density
A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...
These third-party projects greatly expand the ways agents and LLMs can draw on facts, documents, and conversations to deliver ...
The narrative that RAG is dead has been repeated by enough credible voices that many engineering leaders have started to ...
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Oxide-based chip element merges processing and memory, advancing neuromorphic computing
Neuromorphic computing is a computational paradigm that mimics the way the brain functions in terms of both architecture and ...
Researchers developed a new chip stacking method that could quadruple AI memory density, potentially solving one of the biggest hardware bottlenecks slowing AI down today.
Part 1 of this min-series established why CXL Type 3 memory expanders matter for capacity-bound workloads and where expander ...
As modern vehicles become increasingly software-driven and OEMs continue to tighten security, the company has had to work ...
It is tempting to picture UALink as a clean line between two accelerators: requests enter one side, responses emerge from the other. The abstraction is useful — but it conceals almost everything that ...
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