Abstract: A leading-edge 90-nm technology with 1.2-nm physical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and low-/spl kappa/ CDO for high-performance ...
Abstract: Structural advancements of 5-nm node bulk fin-shaped field-effect transistors (FinFETs) without punch-through-stopper (PTS) were introduced using fully calibrated TCAD for the first time. It ...