Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
Abstract: This paper presents a diagnostic and prognostic condition monitoring method for insulated-gate bipolar transistor (IGBT) power modules for use primarily in electric vehicle applications. The ...
Danish technology and engineering conglomerate Danfoss Group's high-end electronic components plant in Nanjing, Jiangsu province will commence production in the second half, after the opening of its ...
Modern chips, which are becoming increasingly complex and integrated, are gradually propelling the entire semiconductor industry forward, making chip quality and related technological breakthroughs ...
The 800 VDC transition is driving SST adoption, but semiconductor choices and nascent deployments mean the technology is still finding its footing. Part 1 of this series covered the key takeaways from ...
Textechno offers a portfolio of testing systems spanning single-fiber characterization, matrix adhesion and intermediate ...
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SemiQ Inc. has expanded its QSiC Dual3 family of half-bridge MOSFET modules, adding high-thermal-performance options with AlN substrates and pre-applied TIM (thermal interface material), as well as ...
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