IEEE Spectrum on MSN
Stacking chips sideways gives AI more memory
Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...
Tom's Hardware on MSN
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
The patent was filed 18 months ago, and there's no further indication of ongoing development ...
SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
Tuttle Capital Management announces the launch of the Tuttle Capital Concentrated Memory Stack ETF (HBMX), a thematic, actively managed ETF designed to provide focused exposure to companies operating ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Use left and right arrow keys to seek audio. SK hynix CEO Kwak Noh-Jung has just announced the company's new vision of its "Full Stack AI Memory Creator" at the SK AI Summit 2025 event, hosted in ...
In early June 2026, Micron Technology showcased a comprehensive portfolio of AI-optimized memory and storage at COMPUTEX 2026, spanning HBM4, advanced DRAM, LPCAMM2, GDDR7 and ultra–high-capacity SSDs ...
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