Applied Materials targets over 50% packaging revenue growth in 2026 as AI demand fuels HBM, 3D chiplet stacking and ...

Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency ...

BE Semiconductor is a leading provider of assembly equipment for AI-optimized chips, benefiting directly from the AI boom.

While much has been said about advanced packaging in the context of Malaysia's semiconductor sector, little is actually known ...

Over the past several decades, the semiconductor industry has experienced sustained growth. Early expansion was driven by the ...

Asahi Kasei opens new slitting facility in Taiwan to boost semiconductor packaging materials production amid rising AI demand ...

Citi’s target hike is tied to broader, more durable AI demand (custom AI chips, cloud TPUs, networking, optical, CPUs) plus ...

DePoly inaugurates Switzerland's first depolymerization facility, transforming plastic waste into virgin-quality materials.

KLA Corporation benefits from AI-driven demand and advanced packaging, with management forecasting 13-17% annual growth. Learn why KLAC stock is a sell.

July-August 2026 The July issue of Supply Chain Management Review explores how organizations are preparing for the future ...

Samsung, SK Hynix and Micron are pouring billions into new factories, but long construction cycles, HBM demand and ...

LG Chem, Asahi Kasei, and Sumitomo Chemical—have collectively announced plans for capacity expansion, technical cooperation, ...