IEEE

Interfacial Charge Dynamics in Power Module Packaging Insulation Based on Non-Invasive Electric Potential Mapping

Abstract: The application of power modules under higher voltages and power densities has become increasingly widespread. However, this trend also highlights growing concerns regarding the reliability ...
Tech Xplore

Designed to tempt: How mini AI lines up carrots to look their best

The researchers teach the packaging machine what is up and down on a snack carrot. The program runs on a small, local PC—not ...
note

[Lean Introduction #53] the simplest approach ― Defining a custom tactic simp_add in one line: Algorithm World Level 4

This is Algorithm World Level 4, "the simplest approach." In the previous level, you learned how to use simp only [add_left_comm, add_comm], but in this level, you will learn how to give that ...
IEEE

A Genetic Algorithm-Based Metaheuristic Approach for Test Cost Optimization of 3D SIC

Abstract: Demand for small, multi-functional, high performance electronic product with less power consumption is increasing rapidly. To meet the demand, IC design has been shifted from two dimensional ...