UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...

Partron, a global electronics components and sensor company, and Syntiant Corp., a leading provider of full-stack, low-power physical AI solutions comprising sensors, processors and ML models, today ...

Microchip Technology recently announced the availability of its new 3,3 kV HV‑D3 mSiC Power Modules, designed to simplify and accelerate the adoption of solid-state transformers ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

The above button links to Coinbase. Yahoo Finance is not a broker-dealer or investment adviser and does not offer securities or cryptocurrencies for sale or facilitate trading. Coinbase pays us for ...

Apple's fall announcements will include the iPhone 18 Pro and iPhone Ultra. Here's what to expect from the chip that will ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

Production-ready 3DI technology supports more compact FEMs for advanced 5G devicesMALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production ...

Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...