Tom's Hardware on MSN
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
The patent was filed 18 months ago, and there's no further indication of ongoing development ...
Researchers developed a new chip stacking method that could quadruple AI memory density, potentially solving one of the biggest hardware bottlenecks slowing AI down today.
Tech Xplore on MSN
AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density
A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...
IEEE Spectrum on MSN
Stacking chips sideways gives AI more memory
Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...
AI-driven demand has transformed memory chips into one of the market's strongest investment themes. This story explains why ...
The narrative that RAG is dead has been repeated by enough credible voices that many engineering leaders have started to ...
Gartner®, a leading global technology research and consulting firm, has released its 2026 Magic Quadrant™ for Cloud AI Infrastructure report. Huawei Cloud has been named a Leader in the report, ...
Meta is doubling down on AI agents with Muse Spark 1.1, a model that doesn't just answer questions — it can use apps, browse ...
Meta has provided a rare glimpse into the company's storage infrastructure, claiming the system underpinning its AI ...
Penguin Solutions (NASDAQ:PENG) held its third-quarter earnings conference call on Tuesday. Below is the complete transcript ...
The news reframes AI demand: agentic AI needs far more CPU orchestration than GPU-only training. AMD is structurally built ...
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