Part 1 of this min-series established why CXL Type 3 memory expanders matter for capacity-bound workloads and where expander ...
The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
Look to these tools to improve your AI coding practices and the quality, security, and reliability of your AI-generated code.
AMD’s new Versal Premium Gen 2 Memory on Package integrates up to 32GB of LPDDR5X directly into the chip package for up to ...
Micron stock might be more expensive than it appears.
NVIDIA Rubin Ultra GPU cancelled: the original four-die design is gone just three months after GTC 2026, replaced by a dual-die version with half the memory stacks and roughly half the real-world ...
As AI drives the marginal cost of software development down, the real enterprise bottleneck may no longer be code. That shift ...
The Gaslight macOS malware from a North Korean cluster doesn't bypass AI analysis platforms yet, but its 38-message prompt injection cascade makes the direction of travel clear. Here's why this ...
AMD gains attention as AI chip demand, server processor growth, and semiconductor strength place the company back in market ...
The AI boom doesn't run on GPUs. It runs on a 12-layer tower of memory, and here's why that monopoly is now setting the price ...
IEEE Spectrum on MSN
Stacking chips sideways gives AI more memory
Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...
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