Tech Xplore on MSN

AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...
Tom's Hardware on MSN

Researchers turn HBM on its side to tackle AI memory’s heat wall

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond ...
Electronic Design

AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC

The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.

This new chip stacking technique could be the key to unlocking faster AI performance

Researchers developed a new chip stacking method that could quadruple AI memory density, potentially solving one of the biggest hardware bottlenecks slowing AI down today.
Hackaday

He Comes To Bury Segmented Memory, Not To Praise It

BillPg] has been designing a fantasy 1980s-era home computer. As part of the exercise, he’s reevaluating all the assumptions that have grown organically over time in the small computer ...
IEEE Spectrum on MSN

Stacking chips sideways gives AI more memory

Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...
Tech Times

AMD Puts DRAM in the Chip Package to Save Board Space and Dodge the HBM Crunch

AMD’s new Versal Premium Gen 2 Memory on Package integrates up to 32GB of LPDDR5X directly into the chip package for up to ...