Samsung Electronics has delayed the mass production schedule for its Compute Express Link (CXL) 3.1-based memory module, the CMM-D 3.0, as launches of CXL 3.1-compatible central processing units (CPUs ...

Lexar is preparing to launch a new line of high-performance DDR5 memory modules built around DRAM chips from ChangXin Memory ...

Traditional server-based datacenters suffer from low resource utilization, insufficient hardware scalability, insufficient resource usage elasticity, ...

With BIOS support for memory chips from China's CXMT, MSI unlocks much faster kits from the niche memory brand. In 2026, more ...

AMD has introduced its Versal Premium Gen 2 Memory on Package (MoP) adaptive system-on-chip (SoC) family, integrating ...

Pickering Interfaces unveils new PXI/PXIe analogue output modules, broadening its portfolio of simulation solutions.

In case you were wondering in which country you should buy a Pixel phone, you world traveler you.

China’s Longsys has reached a stable monthly production capacity of one million micro solid-state ...

AI agents such as OpenClaw are turning developer workstations into always-on edge servers. We test whether the Dell Pro Max ...

A leaked motherboard confirms the iPad Mini 8 will feature the A20 Pro chip, 12GB of RAM, and an OLED display.

An industrial controller brings AI to machines, enabling local data processing and support for robotics, machine vision and ...

Alignment accuracy, surface preparation, and process control are key factors in bringing hybrid bonding into semiconductor ...