From overcoming classical optical limits to tracking single proteins in real time, super-resolution imaging continues to ...

The optical band gap energy of ZnO nanorods was estimated by different methods found in literature. These nanorods were deposited onto TiO 2 covered borosilicate glass substrates by aerosol assisted ...

A technique that supersizes cells to reveal minute details has gone big — really big. Using a polymer similar to those used in nappies to make them super-absorbent, scientists have expanded the volume ...

Electrons are tiny and constantly in motion. How they behave in a crystal lattice determines key material properties: electrical conductivity, magnetism, or novel quantum effects. Anyone aiming to ...

Scientists have unveiled a new way to capture ultra-sharp optical images without lenses or painstaking alignment. The approach uses multiple sensors to collect raw light patterns independently, then ...

Three-dimensional structured illumination microscopy (3D-SIM) doubles the resolution of fluorescence imaging in all directions and enables optical sectioning with increased image contrast. However, 3D ...

Optical microscopy is a technique employed to closely view a sample through the magnification of a lens with visible light. This is the traditional form of microscopy, which was first invented before ...

Log into iLab to see the schedule and availability, or email Dr. Preston Larson (plarson@ou.edu) for questions and consultations regarding SEM. The SEM Capabilities ...

Abstract: This work explores the growth of vertically aligned zinc oxide nanorod (ZnO NR) arrays on a conductive indium-tin-oxide (ITO) substrate by using a simple hydrothermal solution route method ...

You will combine taught modules with a year-long extended project whereby the course will help you gain extensive knowledge in a particular subject area, as you develop vital research skills. You will ...

View Bruker Corporation BRKR stock quote prices, financial information, real-time forecasts, and company news from CNN.

Stacking chips is making it far more difficult to find existing and latent defects, and to check for things like die shift, leftover particles from other processes, co-planarity of bumps, and adhesion ...